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Arm is expanding its computing platform for an era in which artificial intelligence does more than respond to individual prompts. The company expects AI agents to operate continuously across phones, data centers, vehicles, robots and other physical systems—perceiving their surroundings, reasoning about objectives and … Read More The post Arm targets the agentic AI era with new edge, cloud and robotics platforms appeared first on SemiWiki.

Instead of tweaking existing designs, VSORA built an AI chip from scratch to fix the real bottleneck: moving data fast enough to keep the math circuits busy. There’s a version of the AI hardware story that everyone in the chip industry has heard a hundred times. A startup raises money on a clever chip design, promises to topple… Read More The post Rethinking AI Chips: How VSORA Redesigned the Hardware That Runs AI appeared first on SemiWiki.

Deep-ultraviolet (DUV) immersion lithography remains a critical patterning technology for advanced semiconductor manufacturing. Using a 193 nm ArF exposure system with water between the projection lens and wafer, immersion lithography increases numerical aperture and enables smaller features than dry exposure. However,… Read More The post A Study of Photoresist Bake Influence on Stochastics for DUV Immersion Lithography appeared first on SemiWiki.

Ceva and LG Electronics have joined forces to remove one of the biggest obstacles to ultra-wideband adoption: integrating a complete radio, baseband and software stack into a production system-on-chip. Their joint platform combines Ceva-Waves UWB baseband intellectual property and software with an RF front end developed… Read More The post UWB Without the Integration Headache: Ceva and LG Bring Precision to More Chips appeared first on SemiWiki.

By Tim Messegee, Senior Director of Solutions Marketing at Rambus PCI Express (PCIe), PCIe switches, Time Division Multiplexing (TDM), Network Interface Cards (NICs), and SmartNICs are all well-established technologies that have formed the backbone of computing and networking systems for years. More recently, SuperNICs… Read More The post PCIe 7 Switch IP with Time Division Multiplexing: Powering the Next Generation of AI Connectivity appeared first on SemiWiki.