A Study of Photoresist Bake Influence on Stochastics for DUV Immersion Lithography

Deep-ultraviolet (DUV) immersion lithography remains a critical patterning technology for advanced semiconductor manufacturing. Using a 193 nm ArF exposure system with water between the projection lens and wafer, immersion lithography increases numerical aperture and enables smaller features than dry exposure. However,… Read More The post A Study of Photoresist Bake Influence on Stochastics for DUV Immersion Lithography appeared first on SemiWiki.