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GENERATIVE AI AND FOUNDATION MODELS
RAMageddon 2027: Why AI Demand Could Keep Memory Prices High
RAMageddon 2027 is becoming a growing concern for the technology industry as the ongoing memory shortage is showing little sign of easing, and the situation could become even tighter in 2027. A new report suggests that major memory manufacturers have already sold or allocated their 2027 DRAM and HBM production capacity, as companies rush to […]
MICRONSK HYNIX
IGN NordicIGNKotaku
WccftechWccftech
SEMICONDUCTOR DESIGN AND FABRICATION
AMD Says A Hybrid-Bonded 3D DRAM Is 17x More Energy Efficient Than An HBM Stack That Relies On Microbumps, But Thermal Hurdles Block Commercialization
The silicon industry has arrived at a consensus that the HBM pathway to unlock incremental AI compute is stalling, especially as converting silicon wafers into an HBM stack yields far less usable capacity than commodity DRAM, prompting the wider industry to start experimenting with SRAM-only decode, Processor-In-Memory (PIM) within LPDDR, CXL pooling, and 3D DRAM. Of course, it is the 3D DRAM architecture that is considered somewhat of a panacea at the moment, as highlighted by AMD's recent admission as to its phenomenal energy efficiency. Even so, odious hurdles continue to prevent the commercialization of this promising technology. AMD has […]
AMDUNIVERSITY OF TORONTO